Adhesion Strength Specification

    Part shall be heat bonded on a piece of glass or on a PCB. Adhesion strength shall be measured as described below.

Measuring conditions:
Peel off direction 90 degrees
Peel off speed 100 mm/minute.
Test substrate: Glass or PCB
Depth of bonding ledge    3.0mm       2.5mm
Under the environmental condition of: Ambient
X direction, more than    500 g/cm    500g/cm
Y direction, more than    200 gr      180gr
Under the environmental condition of: Rated Temp. & Humidity
X direction, more than    400 g/cm    400 g/cm
Y direction, more than    180 gr      160 gr