Adhesion Strength Specification
Part shall be heat bonded on a piece of glass or on a PCB. Adhesion strength shall be measured as described below.
Measuring conditions: Peel off direction 90 degrees Peel off speed 100 mm/minute. Test substrate: Glass or PCB
Depth of bonding ledge 3.0mm 2.5mm
Under the environmental condition of: Ambient X direction, more than 500 g/cm 500g/cm Y direction, more than 200 gr 180gr
Under the environmental condition of: Rated Temp. & Humidity X direction, more than 400 g/cm 400 g/cm Y direction, more than 180 gr 160 gr